Category:Shawna M. Liff of Scottsdale AZ (US)
Shawna M. Liff
Shawna M. Liff from Scottsdale AZ (US) has applied for patents in technology areas such as H01L25/065, H01L23/498, H01L25/00 with intel corporation.
Patents
Pages in category "Shawna M. Liff of Scottsdale AZ (US)"
The following 16 pages are in this category, out of 16 total.
1
- 18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18596488. ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract (Intel Corporation)
- 18597684. MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract (Intel Corporation)
- 18746188. DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18887368. SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTERFACES (Intel Corporation)
- 18942054. MICROELECTRONIC ASSEMBLIES (Intel Corporation)
I
- Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240136323). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract
- Intel corporation (20240213216). MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240274576). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240339410). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240355750). MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract
- Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract
- Intel corporation (20250070083). MICROELECTRONIC ASSEMBLIES