20240021416. CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)

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CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT

Organization Name

Taiwan Semiconductor Manufacturing Company Limited

Inventor(s)

Ming-Sze Chen of Hsinchu City (TW)

Hung-Chih Wang of Taichung City (TW)

Yuan-Hsin Chi of Taichung County (TW)

Sheng-Yuan Lin of Hsinchu City (TW)

CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240021416 titled 'CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT

Simplified Explanation

The abstract describes a connect structure for semiconductor processing equipment. It involves a housing that is designed to connect a deformable pipe with a non-deformable pipe. The housing has a first annular sidewall to receive the deformable pipe and a second annular sidewall with a threaded structure. An annular bead is connected to the first sidewall to flexibly deform the deformable pipe towards the non-deformable pipe when the threaded structures engage each other.

  • The connect structure is designed to connect a deformable pipe with a non-deformable pipe in semiconductor processing equipment.
  • The housing of the connect structure has a first annular sidewall to receive the deformable pipe.
  • The housing also has a second annular sidewall with a threaded structure.
  • An annular bead is connected to the first sidewall to flexibly deform the deformable pipe towards the non-deformable pipe when the threaded structures engage each other.

Potential applications of this technology:

  • Semiconductor processing equipment
  • Industrial piping systems
  • Chemical processing equipment

Problems solved by this technology:

  • Ensures a secure and flexible connection between a deformable pipe and a non-deformable pipe in semiconductor processing equipment.
  • Prevents leaks and maintains the integrity of the piping system.
  • Allows for easy installation and removal of the pipes.

Benefits of this technology:

  • Improved reliability and efficiency in semiconductor processing equipment.
  • Reduces the risk of leaks and potential damage to the equipment.
  • Simplifies the installation and maintenance process of the pipes.


Original Abstract Submitted

a connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. the housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. an annular bead is connected to the first annular sidewall to flexibly deform the deformable pipe toward the non-deformable pipe structure when the first thread structure rotatably engages a second thread structure of the non-deformable pipe.

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