17567497. PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chung-Ming Weng of Hsinchu (TW)

Chen-Hua Yu of Hsinchu (TW)

Chung-Shi Liu of Hsinchu (TW)

Hao-Yi Tsai of Hsinchu (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Hung-Yi Kuo of Taipei (TW)

Tsung-Yuan Yu of Taipei (TW)

Hua-Kuei Lin of Hsinchu (TW)

Che-Hsiang Hsu of Hsinchu (TW)

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17567497 titled 'PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Simplified Explanation

The patent application describes a package that includes a photonic layer on a substrate, an interconnect structure, an electronic die, and a first dielectric layer. It also includes a socket and a fiber holder that re-orients the optical path of an optical signal.

• The package includes a photonic layer with a silicon waveguide coupled to a grating coupler.
• An interconnect structure is placed over the photonic layer.
• An electronic die is connected to the interconnect structure.
• A first dielectric layer is placed over the interconnect structure and electronic die.
• A first substrate is bonded to the electronic die and the first dielectric layer.
• A socket is attached to the top surface of the first substrate.
• A fiber holder is coupled to the first substrate through the socket.
• The fiber holder includes a prism that re-orients the optical path of an optical signal.

Potential Applications

• Optical communication systems
• Data centers
• Telecommunications networks
• Fiber optic networks

Problems Solved

• Efficient coupling of optical signals into the photonic layer
• Re-orienting the optical path of an optical signal
• Integration of electronic and photonic components

Benefits

• Improved performance and efficiency of optical communication systems
• Simplified packaging and integration of electronic and photonic components
• Enhanced signal transmission and reception in fiber optic networks

Original Abstract Submitted

A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.