17712319. SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICES

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Bongkwan Baek of Seoul (KR)

Junghwan Chun of Anyang-si (KR)

Jongmin Baek of Seoul (KR)

Koungmin Ryu of Hwaseong-si (KR)

SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17712319 titled 'SEMICONDUCTOR DEVICES

Simplified Explanation

The abstract describes a semiconductor device that includes a gate structure, source and drain layers, contact plugs, and insulation patterns with different carbon concentrations. The device aims to improve the performance and efficiency of semiconductor devices.

  • The semiconductor device includes a gate structure, source and drain layers, contact plugs, and insulation patterns.
  • The insulation pattern structure has different carbon concentrations.
  • The device is designed to be disposed on a substrate.
  • The first contact plug is disposed on the source and drain layer.
  • The second contact plug is disposed on the gate structure.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Electronics industry
  • Integrated circuit design and production

Problems solved by this technology:

  • Improves the performance and efficiency of semiconductor devices
  • Enhances the functionality and reliability of integrated circuits
  • Reduces power consumption and heat generation in electronic devices

Benefits of this technology:

  • Improved performance and efficiency of semiconductor devices
  • Enhanced functionality and reliability of integrated circuits
  • Reduced power consumption and heat generation in electronic devices
  • Potential for smaller and more compact electronic devices.


Original Abstract Submitted

A semiconductor device includes a gate structure disposed on a substrate; a source and drain layer disposed on the substrate adjacent the gate structure; a first contact plug disposed on the source and drain layer; an insulation pattern structure disposed on the first contact plug, the insulation pattern structure including insulation patterns having different carbon concentrations; and a second contact plug disposed on the gate structure.