17654907. Dicing Process in Packages Comprising Organic Interposers simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Dicing Process in Packages Comprising Organic Interposers
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chipta Priya Laksana of Taoyuan City (TW)
Chun-Lung Jao of Shuili Township (TW)
Shu-Shen Yeh of Taoyuan City (TW)
Chien-Sheng Chen of Hsinchu (TW)
Dicing Process in Packages Comprising Organic Interposers - A simplified explanation of the abstract
This abstract first appeared for US patent application 17654907 titled 'Dicing Process in Packages Comprising Organic Interposers
Simplified Explanation
The patent application describes a method for forming an interconnect component with multiple dielectric layers and redistribution lines. It also includes bonding package components, encapsulating them, and precutting the interconnect component to form a trench. The singulation process is then performed to separate the package components into individual packages.
- The method involves forming an interconnect component with multiple dielectric layers and redistribution lines.
- The interconnect component is bonded with package components and encapsulated in an encapsulant.
- A trench is formed by precutting the interconnect component using a blade, penetrating through the component and partially into the encapsulant.
- The singulation process is performed to separate the package components into individual packages.
Potential Applications
This technology can be applied in various industries and applications, including:
- Semiconductor manufacturing
- Electronics packaging
- Integrated circuit assembly
Problems Solved
The method described in the patent application addresses several challenges in the manufacturing and assembly processes, such as:
- Ensuring proper interconnection between package components
- Efficiently separating individual packages from a larger component
- Maintaining the integrity and functionality of the interconnect component during singulation
Benefits
The use of this technology offers several benefits, including:
- Improved interconnectivity and reliability of package components
- Enhanced efficiency and accuracy in the singulation process
- Cost savings in manufacturing and assembly processes
Original Abstract Submitted
A method includes forming an interconnect component including a plurality of dielectric layers that include an organic dielectric material, and a plurality of redistribution lines extending into the plurality of dielectric layers. The method further includes bonding a first package component and a second package component to the interconnect component, encapsulating the first package component and the second package component in an encapsulant, and precutting the interconnect component using a blade to form a trench. The trench penetrates through the interconnect component, and partially extends into the encapsulant. The method further includes performing a singulation process to separate the first package component and the second package component into a first package and a second package, respectively.
