18133105. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR PACKAGE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

JONGBO Shim of Suwon-si (KR)

JI-YONG Park of Suwon-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18133105 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract describes a semiconductor package that includes a redistribution substrate, a semiconductor chip, and vertical conductive structures. Each vertical conductive structure consists of a wire covered by a metal layer, with the top surface of the wire exposed.

• The semiconductor package includes a redistribution substrate, which helps in connecting the semiconductor chip to other components.
• The semiconductor chip is mounted on the redistribution substrate.
• Vertical conductive structures are present, which are spaced apart from the side surface of the semiconductor chip.
• Each vertical conductive structure consists of a wire and a metal layer covering the side surface of the wire.
• The top surface of the wire is exposed from the metal layer.

Potential Applications

• This semiconductor package can be used in various electronic devices such as smartphones, tablets, and computers.
• It can be utilized in automotive electronics, medical devices, and industrial equipment.

Problems Solved

• The semiconductor package solves the problem of connecting the semiconductor chip to other components efficiently.
• It addresses the need for reliable and compact packaging solutions for semiconductor devices.

Benefits

• The use of vertical conductive structures allows for better space utilization and compact packaging.
• The exposed top surface of the wire provides flexibility for further connections or integration with other components.
• The metal layer covering the wire enhances the conductivity and reliability of the vertical conductive structures.

Original Abstract Submitted

A semiconductor package includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, and vertical conductive structures spaced apart from a side surface of the semiconductor chip. Each of the vertical conductive structures includes a wire, and a metal layer covering a side surface of the wire. A top surface of the wire is exposed from the metal layer.