NICHIA CORPORATION patent applications published on November 30th, 2023

Patent applications for NICHIA CORPORATION on November 30th, 2023

PHOSPHOR CERAMIC, LIGHT-EMITTING DEVICE AND MANUFACTURING METHODS THEREFOR (18325543)

Main Inventor

Takeshi SADAMOCHI

Brief explanation

The patent application describes a method for manufacturing a phosphor ceramic using aluminum nitride and manganese gas. 

• The method involves preparing a precursor that includes aluminum nitride.
• The precursor is then brought into contact with a gas containing manganese.
• This contact between the precursor and manganese gas leads to the formation of the phosphor ceramic.
• The phosphor ceramic is used in various applications such as lighting, displays, and sensors.

Abstract

A method for manufacturing a phosphor ceramic, the method including preparing a precursor including aluminum nitride, and forming the phosphor ceramic by bringing the precursor into contact with a gas containing manganese.

HALOPHOSPHATE PHOSPHOR, MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING DEVICE (18324113)

Main Inventor

Ryuta MIYAI

Brief explanation

The abstract of the patent application describes a halophosphate phosphor that contains calcium, europium, and chlorine. It states that the phosphor has a low elution amount of chlorine ions when exposed to hot water.

• The patent application is for a halophosphate phosphor.
• The phosphor contains an alkaline earth metal, specifically calcium.
• It also contains europium, a rare earth metal.
• The phosphor includes a halogen, specifically chlorine.
• When the phosphor is in contact with pure water at 85°C for five hours, the elution amount of chlorine ions is 7 ppm or less.
• This low elution amount indicates that the phosphor has good stability and does not release significant amounts of chlorine ions when exposed to hot water.

Abstract

The halophosphate phosphor includes a halophosphate including an alkaline earth metal including at least calcium; europium; and a halogen including at least chlorine. An elution amount of chlorine ions after the halophosphate phosphor is brought into contact with 10 times by mass of pure water at 85° C. for five hours is 7 ppm or less.

COATED RARE EARTH-IRON-NITROGEN-BASED MAGNETIC POWDER, PRODUCTION METHOD THEREOF, MAGNETIC MATERIAL FOR MAGNETIC FIELD AMPLIFICATION, AND MAGNETIC MATERIAL FOR HYPER-HIGH FREQUENCY ABSORPTION ([[US Patent Application 18324341. COATED RARE EARTH-IRON-NITROGEN-BASED MAGNETIC POWDER, PRODUCTION METHOD THEREOF, MAGNETIC MATERIAL FOR MAGNETIC FIELD AMPLIFICATION, AND MAGNETIC MATERIAL FOR HYPER-HIGH FREQUENCY ABSORPTION simplified abstract (NICHIA CORPORATION)|18324341]])

Main Inventor

Jun AKAMATSU

Brief explanation

The abstract describes a coated magnetic powder made of rare earth-iron-nitrogen-based materials. Here are the key points:

• The powder consists of a core region, a first coating portion, and a second coating portion.
• The core region contains rare earth elements (R), iron (Fe), and nitrogen (N).
• The rare earth elements can be Y, Ce, Pr, Nd, Gd, Tb, Dy, Ho, Er, Tm, Lu, or Sm (if Sm is present, it is less than 50% of the total rare earth content).
• The powder is structured in the following order: core region, first coating portion, and second coating portion.
• The first coating portion contains phosphorus (P) and rare earth elements (R), with a higher average atomic concentration of R compared to the core region (but not more than twice).
• The second coating portion has lower average atomic concentrations of P and R compared to the first coating portion.
• Both the first and second coating portions contain iron (Fe).

Overall, this patent application describes a specific composition and structure of a coated magnetic powder using rare earth-iron-nitrogen-based materials.

Abstract

A coated rare earth-iron-nitrogen-based magnetic powder including: a core region; a first coating portion provided outside the core region; and a second coating portion, the core region containing R, Fe, and N, where R represents at least one selected from the group consisting of Y, Ce, Pr, Nd, Gd, Tb, Dy, Ho, Er, Tm, Lu, and Sm, and if Sm is present, Sm constitutes less than 50 atm % of the total R content, the powder including, in an order from the core region, the first coating portion containing P and R, an average atomic concentration of R in the first coating portion being higher than and not higher than twice an average atomic concentration of R in the core region, and the second coating portion having average atomic concentrations of P and R lower than those in the first coating portion, respectively, and containing Fe.

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE (18306348)

Main Inventor

Koji NISHINO

Brief explanation

The patent application describes a method for manufacturing a light-emitting device using a support member and first light-emitting elements.

• The method involves providing first light-emitting elements and a support member with wiring portions.
• The first light-emitting elements and wiring portions are joined together under specific conditions.
• The electrical characteristics of each first light-emitting element are evaluated.
• If any first light-emitting element is found to be defective, it is removed from the support member.
• The method ensures that only functional first light-emitting elements are used in the final device.

Abstract

A method for manufacturing a light-emitting device includes: providing a plurality of first light-emitting elements, each comprising a joining portion containing gold; providing a support member including: a substrate, and a plurality of wiring portions, each disposed on the substrate and containing gold; joining the joining portions of the first light-emitting elements and corresponding wiring portions of the plurality of wiring portions under a first joining condition; evaluating whether at least one first light-emitting element of the plurality of first light-emitting elements is removable from the support member; evaluating electrical characteristics of each of the plurality of first light-emitting elements; and if the at least one first light-emitting element is removed from the support member, removing from the support member a first light-emitting element determined to be defective in the step of evaluating electrical characteristics of each of the plurality of first light-emitting elements.

METHOD OF PRODUCING SEMICONDUCTOR DEVICE (18310002)

Main Inventor

Yoshiki YAMAGUCHI

Brief explanation

The patent application describes a method for producing a semiconductor device by detecting and removing defects in a semiconductor layer.

• The method involves forming a metal film on the semiconductor layer.
• A first laser emitting red or infrared light is used to remove a portion of the metal film and expose the semiconductor layer.
• A second laser emitting ultraviolet light is then used to remove a portion of the semiconductor layer, including the detected defect.
• The diameter of the metal film portion is larger than the diameter of the semiconductor layer portion in a plan view.
• The metal film portion overlaps with the semiconductor layer portion in the plan view.

Abstract

A method of producing a semiconductor device, the method includes steps of: detecting a defect included in a semiconductor layer; forming a metal film on the semiconductor layer; after forming the metal film on the semiconductor layer, exposing the semiconductor layer through the metal film by removing a portion of the metal film by irradiation with a first laser emitting red or infrared light; and after the step of exposing the semiconductor layer, removing a portion of the semiconductor layer by irradiation with a second laser emitting ultraviolet light, said portion of the semiconductor layer including the defect. A diameter of said portion of the metal film is greater than a diameter of said portion of the semiconductor layer in a plan view. Said portion of the metal film overlaps with said portion of the semiconductor layer in the plan view.

LIGHT EMITTING DEVICE (18323335)

Main Inventor

Soichiro MIURA

Brief explanation

The patent application describes a light emitting device with a package that includes a base member, a frame member, and a cover.

• The device also includes a light emitting element that emits directional light in a lateral direction.
• A light receiving body is also included, which is surrounded by the frame member and positioned on the upper surface of the base member.
• The light receiving body has a first lateral surface facing the light emitting element and a second lateral surface opposite to the first lateral surface.
• The second lateral surface of the light receiving body faces a first opposing surface with a space between them.

Abstract

A light emitting device includes a package including a base member, a frame member having a plurality of inner lateral surfaces, and a cover, a light emitting element surrounded by the frame member and disposed on an upper surface of the base member, the light emitting element configured to emit directional light traveling in a lateral direction, and a light receiving body surrounded by the frame member and disposed on the upper surface of the base member in the lateral direction of the light emitting element to receive the light. The light receiving body has a first lateral surface facing the light emitting element and a second lateral surface opposite to the first lateral surface. The second lateral surface of the light receiving body faces a first opposing surface arranged adjacent to the second lateral surface with a space between the second lateral surface and the first opposing surface.

LIGHT-EMITTING DEVICE (18323316)

Main Inventor

Soichiro MIURA

Brief explanation

The patent application describes a light-emitting device that includes a base member, a light-emitting element, and a wavelength conversion member.

• The light-emitting element emits light in a lateral direction.
• The wavelength conversion member is positioned at the side of the light-emitting element.
• The wavelength conversion member has a portion for converting the wavelength of light and a surrounding portion.
• Light enters the wavelength conversion portion, undergoes wavelength conversion, and exits through an exit surface.
• The surrounding portion includes a protrusion that overlaps with the emission end surface of the light-emitting element.
• The device aims to provide efficient wavelength conversion and improved light emission.

Abstract

A light-emitting device includes a base member, light-emitting element, and a wavelength conversion member. Light-emitting element is configured to emit light traveling in a lateral direction. The wavelength conversion member is disposed at a lateral side of the light-emitting element. The wavelength conversion member includes a wavelength conversion portion and a surrounding portion. The wavelength conversion portion having an incident lateral surface and an exit surface so that light is incident on the incident lateral surface, undergoes wavelength conversion in the wavelength conversion portion, and exits through the exit surface. The surrounding portion includes a protrusion located above the light-emitting element, and protruding outwardly toward a light-emitting element side with respect to the incident lateral surface with the protrusion overlapping with the emission end surface of the light-emitting element in a top view.

METHOD OF MANUFACTURING LIGHT EMITTING DEVICE (18446382)

Main Inventor

Hirosuke HAYASHI

Brief explanation

The patent application describes a method of manufacturing a light emitting device.

• The device includes a light emitting element, a wavelength conversion member, and a reflecting member.
• The method involves providing the light emitting structure with these components.
• A covering member is then supplied to cover the top surface of the wavelength conversion member and the top surface of the reflecting member.
• The covering member contains a pigment or a dye to match the body color of the wavelength conversion member.
• This ensures that the body color of the covering member is the same or similar to the body color of the wavelength conversion member.

Abstract

A method of manufacturing a light emitting device includes: providing a light emitting structure including a light emitting element having a top surface and lateral surfaces, a wavelength conversion member having a top surface, a bottom surface, and lateral surfaces, with the bottom surface of the wavelength conversion member facing the top surface of the light emitting element, and a reflecting member surrounding the lateral surfaces of the light emitting element and the lateral surfaces of the wavelength conversion member, the reflecting member having a top surface; and supplying a covering member to cover the top surface of the wavelength conversion member and the top surface of the reflecting member, the covering member containing at least one of a pigment and a dye so that a body color of the covering member is the same or a similar color as a body color of the wavelength conversion member.

LIGHT-EMITTING DEVICE (18302418)

Main Inventor

Takuya YAMANOI

Brief explanation

The patent application describes a light-emitting device with a base member and a light-reflective member. 

• The base member has a recess where a light-emitting element is placed.
• The light-reflective member is continuously placed on the upper surface of the base member's bottom portion and a portion of the inner lateral surface of the recess's wall portion.
• The inner lateral surface of the wall portion has three surfaces - a first surface, a second surface above the first surface, and a third surface connecting them.
• The distance between the second surface and the light-emitting element is greater than the distance between the first surface and the light-emitting element.
• The third surface is positioned below the upper surface of the light-emitting element.
• The upper end of the light-reflective member is positioned below the upper surface of the wall portion.

Abstract

A light-emitting device includes a base member having a recess inside which a light-emitting element is disposed; and a light-reflective member continuously disposed on an upper surface of the bottom portion and at least a portion of an inner lateral surface of a wall portion inside the recess of the base member, in a cross-sectional view, the inner lateral surface of the wall portion having a first surface, a second surface located above the first surface, and a third surface connecting the first surface and the second surface, a shortest distance between the second surface and the light-emitting element being larger than a shortest distance between the first surface and the light-emitting element, the third surface being located below an upper surface of the light-emitting element, and an upper end of the light-reflective member being located below an upper surface of the wall portion.

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME (18320668)

Main Inventor

Hiroki TOMINAGA

Brief explanation

The patent application describes a method of manufacturing a light emitting module. 

• The method involves providing an intermediate structure that includes a wiring board with a metal layer, a first conducting member, and a second conducting member.
• A resist layer with openings is then disposed on the intermediate structure.
• A light emitting element with a first electrode and a second electrode is placed on the resist layer, with the electrodes facing the first and second conducting members.
• A portion of the lower surface of the light emitting element is exposed through the openings in the resist layer.
• A first bonding member is formed on the first conducting member, and a second bonding member is formed on the second conducting member.
• Finally, the resist layer is removed.

Abstract

A method of manufacturing a light emitting module includes: providing an intermediate structure that includes a wiring board having an upper surface and including a metal layer, a first conducting member on the metal layer, and a second conducting member on the metal layer; disposing, on the intermediate structure, a resist layer having openings; providing a light emitting element including a first electrode and a second electrode, and disposing the light emitting element on the resist layer such that the first electrode and the second electrode respectively face the first conducting member and the second conducting member while a portion of an outer periphery of the lower surface of the light emitting element is exposed from the resist layer in the openings; forming a first bonding member on the first conducting member and forming a second bonding member on the second conducting member; and removing the resist layer.