US Patent Application 18447211. SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION simplified abstract
SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18447211 titled 'SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION
Simplified Explanation
- The patent application describes a chemical mechanical planarization system. - The system includes a rotating chemical mechanical planarization pad. - A chemical mechanical planarization head places a semiconductor wafer in contact with the pad. - A slurry supply system supplies a slurry onto the pad during the process. - A pad conditioner is used to condition the pad during the process. - A suction system removes debris from the pad, including the pad conditioner and slurry.
Original Abstract Submitted
A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies a slurry onto the pad during the process. A pad conditioner conditions the pad during the process. A suction system removes pad conditioner debris and the slurry from the pad.
