US Patent Application 17990064. SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract

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SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

Organization Name

SK hynix Inc.

Inventor(s)

Jae Young Oh of Gyeonggi-do (KR)

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17990064 titled 'SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

- The patent application describes a semiconductor memory device and a method of manufacturing it. - The semiconductor memory device includes a gate stack and a channel structure within the gate stack. - The channel structure consists of a channel layer with two portions: one that penetrates the gate stack and another that extends higher than the gate stack. - A core insulating layer is located in the central region of the channel structure. - A barrier layer is positioned between the channel layer and the core insulating layer. - The purpose of this design is to improve the performance and efficiency of the semiconductor memory device. - The method of manufacturing the device is not specified in the abstract.


Original Abstract Submitted

Provided herein may be a semiconductor memory device and a method of manufacturing the same. The semiconductor memory device may include a gate stack, and a channel structure disposed in the gate stack, wherein the channel structure may include a channel layer including a first portion penetrating the gate stack and a second portion extending from the first portion to protrude higher than the gate stack, a core insulating layer disposed in a central region of the channel structure, and a barrier layer disposed between the channel layer and the core insulating layer.