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Bibliographic details for US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract

Citation styles for US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract

APA style

US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract. (2023, November 10). WikiPatents, . Retrieved 03:20, May 29, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18341880._CHIP_STACKING_STRUCTURE_AND_MANUFACTURING_METHOD_THEREOF,_CHIP_PACKAGE_STRUCTURE,_AND_ELECTRONIC_DEVICE_simplified_abstract&oldid=6841.

MLA style

"US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract." WikiPatents, . 10 Nov 2023, 01:39 UTC. 29 May 2024, 03:20 <http://wikipatents.org/index.php?title=US_Patent_Application_18341880._CHIP_STACKING_STRUCTURE_AND_MANUFACTURING_METHOD_THEREOF,_CHIP_PACKAGE_STRUCTURE,_AND_ELECTRONIC_DEVICE_simplified_abstract&oldid=6841>.

MHRA style

WikiPatents contributors, 'US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract', WikiPatents, , 10 November 2023, 01:39 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18341880._CHIP_STACKING_STRUCTURE_AND_MANUFACTURING_METHOD_THEREOF,_CHIP_PACKAGE_STRUCTURE,_AND_ELECTRONIC_DEVICE_simplified_abstract&oldid=6841> [accessed 29 May 2024]

Chicago style

WikiPatents contributors, "US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18341880._CHIP_STACKING_STRUCTURE_AND_MANUFACTURING_METHOD_THEREOF,_CHIP_PACKAGE_STRUCTURE,_AND_ELECTRONIC_DEVICE_simplified_abstract&oldid=6841 (accessed May 29, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract [Internet]. WikiPatents, ; 2023 Nov 10, 01:39 UTC [cited 2024 May 29]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18341880._CHIP_STACKING_STRUCTURE_AND_MANUFACTURING_METHOD_THEREOF,_CHIP_PACKAGE_STRUCTURE,_AND_ELECTRONIC_DEVICE_simplified_abstract&oldid=6841.

Bluebook style

US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18341880._CHIP_STACKING_STRUCTURE_AND_MANUFACTURING_METHOD_THEREOF,_CHIP_PACKAGE_STRUCTURE,_AND_ELECTRONIC_DEVICE_simplified_abstract&oldid=6841 (last visited May 29, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_18341880._CHIP_STACKING_STRUCTURE_AND_MANUFACTURING_METHOD_THEREOF,_CHIP_PACKAGE_STRUCTURE,_AND_ELECTRONIC_DEVICE_simplified_abstract&oldid=6841",
   note = "[Online; accessed 29-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18341880. CHIP STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF, CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18341880._CHIP_STACKING_STRUCTURE_AND_MANUFACTURING_METHOD_THEREOF,_CHIP_PACKAGE_STRUCTURE,_AND_ELECTRONIC_DEVICE_simplified_abstract&oldid=6841}",
   note = "[Online; accessed 29-May-2024]"
 }


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