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Bibliographic details for US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract
- Page name: US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 9 November 2023 11:11 UTC
- Date retrieved: 10 June 2024 13:22 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734
- Page Version ID: 6734
Citation styles for US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract
APA style
US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract. (2023, November 9). WikiPatents, . Retrieved 13:22, June 10, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734.
MLA style
"US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract." WikiPatents, . 9 Nov 2023, 11:11 UTC. 10 Jun 2024, 13:22 <http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734>.
MHRA style
WikiPatents contributors, 'US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract', WikiPatents, , 9 November 2023, 11:11 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734> [accessed 10 June 2024]
Chicago style
WikiPatents contributors, "US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734 (accessed June 10, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract [Internet]. WikiPatents, ; 2023 Nov 9, 11:11 UTC [cited 2024 Jun 10]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734.
Bluebook style
US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734 (last visited June 10, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734",
note = "[Online; accessed 10-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18355463. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18355463._OVERSIZED_VIA_AS_THROUGH-SUBSTRATE-VIA_(TSV)_STOP_LAYER_simplified_abstract&oldid=6734}",
note = "[Online; accessed 10-June-2024]"
}
