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Citation styles for 18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, April 12). WikiPatents, . Retrieved 18:35, May 28, 2024 from http://wikipatents.org/index.php?title=18151059._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50992.

MLA style

"18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 12 Apr 2024, 08:56 UTC. 28 May 2024, 18:35 <http://wikipatents.org/index.php?title=18151059._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50992>.

MHRA style

WikiPatents contributors, '18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 12 April 2024, 08:56 UTC, <http://wikipatents.org/index.php?title=18151059._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50992> [accessed 28 May 2024]

Chicago style

WikiPatents contributors, "18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18151059._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50992 (accessed May 28, 2024).

CBE/CSE style

WikiPatents contributors. 18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Apr 12, 08:56 UTC [cited 2024 May 28]. Available from: http://wikipatents.org/index.php?title=18151059._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50992.

Bluebook style

18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=18151059._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50992 (last visited May 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18151059._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50992",
   note = "[Online; accessed 28-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18151059._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50992}",
   note = "[Online; accessed 28-May-2024]"
 }