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Bibliographic details for US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract
- Page name: US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 November 2023 04:07 UTC
- Date retrieved: 10 June 2024 15:02 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077
- Page Version ID: 5077
Citation styles for US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract
APA style
US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract. (2023, November 1). WikiPatents, . Retrieved 15:02, June 10, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077.
MLA style
"US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract." WikiPatents, . 1 Nov 2023, 04:07 UTC. 10 Jun 2024, 15:02 <http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077>.
MHRA style
WikiPatents contributors, 'US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract', WikiPatents, , 1 November 2023, 04:07 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077> [accessed 10 June 2024]
Chicago style
WikiPatents contributors, "US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077 (accessed June 10, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract [Internet]. WikiPatents, ; 2023 Nov 1, 04:07 UTC [cited 2024 Jun 10]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077.
Bluebook style
US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077 (last visited June 10, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract --- WikiPatents{,} ", year = "2023", url = "http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077", note = "[Online; accessed 10-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract --- WikiPatents{,} ", year = "2023", url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18216282._MICROELECTRONIC_DEVICES_DESIGNED_WITH_MOLD_PATTERNING_TO_CREATE_PACKAGE-LEVEL_COMPONENTS_FOR_HIGH_FREQUENCY_COMMUNICATION_SYSTEMS_simplified_abstract&oldid=5077}", note = "[Online; accessed 10-June-2024]" }