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Bibliographic details for US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract

Citation styles for US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract

APA style

US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract. (2023, November 1). WikiPatents, . Retrieved 19:39, June 9, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18346321._MICROELECTRONIC_PACKAGE_WITH_SOLDER_ARRAY_THERMAL_INTERFACE_MATERIAL_(SA-TIM)_simplified_abstract&oldid=5072.

MLA style

"US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract." WikiPatents, . 1 Nov 2023, 04:06 UTC. 9 Jun 2024, 19:39 <http://wikipatents.org/index.php?title=US_Patent_Application_18346321._MICROELECTRONIC_PACKAGE_WITH_SOLDER_ARRAY_THERMAL_INTERFACE_MATERIAL_(SA-TIM)_simplified_abstract&oldid=5072>.

MHRA style

WikiPatents contributors, 'US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract', WikiPatents, , 1 November 2023, 04:06 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18346321._MICROELECTRONIC_PACKAGE_WITH_SOLDER_ARRAY_THERMAL_INTERFACE_MATERIAL_(SA-TIM)_simplified_abstract&oldid=5072> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18346321._MICROELECTRONIC_PACKAGE_WITH_SOLDER_ARRAY_THERMAL_INTERFACE_MATERIAL_(SA-TIM)_simplified_abstract&oldid=5072 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract [Internet]. WikiPatents, ; 2023 Nov 1, 04:06 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18346321._MICROELECTRONIC_PACKAGE_WITH_SOLDER_ARRAY_THERMAL_INTERFACE_MATERIAL_(SA-TIM)_simplified_abstract&oldid=5072.

Bluebook style

US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18346321._MICROELECTRONIC_PACKAGE_WITH_SOLDER_ARRAY_THERMAL_INTERFACE_MATERIAL_(SA-TIM)_simplified_abstract&oldid=5072 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_18346321._MICROELECTRONIC_PACKAGE_WITH_SOLDER_ARRAY_THERMAL_INTERFACE_MATERIAL_(SA-TIM)_simplified_abstract&oldid=5072",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18346321._MICROELECTRONIC_PACKAGE_WITH_SOLDER_ARRAY_THERMAL_INTERFACE_MATERIAL_(SA-TIM)_simplified_abstract&oldid=5072}",
   note = "[Online; accessed 9-June-2024]"
 }


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