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Bibliographic details for 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)

Citation styles for 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)

APA style

17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation). (2024, April 12). WikiPatents, . Retrieved 10:36, June 9, 2024 from http://wikipatents.org/index.php?title=17957783._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=49868.

MLA style

"17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)." WikiPatents, . 12 Apr 2024, 07:30 UTC. 9 Jun 2024, 10:36 <http://wikipatents.org/index.php?title=17957783._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=49868>.

MHRA style

WikiPatents contributors, '17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)', WikiPatents, , 12 April 2024, 07:30 UTC, <http://wikipatents.org/index.php?title=17957783._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=49868> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17957783._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=49868 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Apr 12, 07:30 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17957783._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=49868.

Bluebook style

17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17957783._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=49868 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17957783._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=49868",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17957783._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=49868}",
   note = "[Online; accessed 9-June-2024]"
 }


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