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Bibliographic details for 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)

Citation styles for 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)

APA style

17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation). (2024, April 12). WikiPatents, . Retrieved 13:05, June 9, 2024 from http://wikipatents.org/index.php?title=17956421._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=49859.

MLA style

"17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)." WikiPatents, . 12 Apr 2024, 07:29 UTC. 9 Jun 2024, 13:05 <http://wikipatents.org/index.php?title=17956421._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=49859>.

MHRA style

WikiPatents contributors, '17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)', WikiPatents, , 12 April 2024, 07:29 UTC, <http://wikipatents.org/index.php?title=17956421._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=49859> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17956421._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=49859 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Apr 12, 07:29 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17956421._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=49859.

Bluebook style

17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17956421._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=49859 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17956421._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=49859",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17956421._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=49859}",
   note = "[Online; accessed 9-June-2024]"
 }


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