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Bibliographic details for US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract
- Page name: US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 November 2023 03:41 UTC
- Date retrieved: 2 June 2024 10:36 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826
- Page Version ID: 4826
Citation styles for US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract
APA style
US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract. (2023, November 1). WikiPatents, . Retrieved 10:36, June 2, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826.
MLA style
"US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract." WikiPatents, . 1 Nov 2023, 03:41 UTC. 2 Jun 2024, 10:36 <http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826>.
MHRA style
WikiPatents contributors, 'US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract', WikiPatents, , 1 November 2023, 03:41 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826> [accessed 2 June 2024]
Chicago style
WikiPatents contributors, "US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826 (accessed June 2, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract [Internet]. WikiPatents, ; 2023 Nov 1, 03:41 UTC [cited 2024 Jun 2]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826.
Bluebook style
US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826 (last visited June 2, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract --- WikiPatents{,} ", year = "2023", url = "http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826", note = "[Online; accessed 2-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "US Patent Application 17882203. 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER simplified abstract --- WikiPatents{,} ", year = "2023", url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_17882203._3D-STACKED_SEMICONDUCTOR_DEVICE_INCLUDING_SOURCE/DRAIN_INNER_SPACERS_FORMED_USING_CHANNEL_ISOLATION_STRUCTURE_INCLUDING_THIN_SILICON_LAYER_simplified_abstract&oldid=4826}", note = "[Online; accessed 2-June-2024]" }