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Bibliographic details for Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
- Page name: Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 10 April 2024 06:45 UTC
- Date retrieved: 2 June 2024 08:10 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000
- Page Version ID: 47000
Citation styles for Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
APA style
Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract. (2024, April 10). WikiPatents, . Retrieved 08:10, June 2, 2024 from http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000.
MLA style
"Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract." WikiPatents, . 10 Apr 2024, 06:45 UTC. 2 Jun 2024, 08:10 <http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000>.
MHRA style
WikiPatents contributors, 'Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract', WikiPatents, , 10 April 2024, 06:45 UTC, <http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000> [accessed 2 June 2024]
Chicago style
WikiPatents contributors, "Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000 (accessed June 2, 2024).
CBE/CSE style
WikiPatents contributors. Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract [Internet]. WikiPatents, ; 2024 Apr 10, 06:45 UTC [cited 2024 Jun 2]. Available from: http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000.
Bluebook style
Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract, http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000 (last visited June 2, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000",
note = "[Online; accessed 2-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Apple_inc._(20240105545)._Thermally_Enhanced_Chip-on-Wafer_or_Wafer-on-Wafer_Bonding_simplified_abstract&oldid=47000}",
note = "[Online; accessed 2-June-2024]"
}
