Cite This Page

Citation styles for 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)

APA style

17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation). (2024, March 25). WikiPatents, . Retrieved 11:09, June 9, 2024 from http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443.

MLA style

"17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)." WikiPatents, . 25 Mar 2024, 03:36 UTC. 9 Jun 2024, 11:09 <http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443>.

MHRA style

WikiPatents contributors, '17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)', WikiPatents, , 25 March 2024, 03:36 UTC, <http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Mar 25, 03:36 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443.

Bluebook style

17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443}",
   note = "[Online; accessed 9-June-2024]"
 }