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Bibliographic details for 17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)

Citation styles for 17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)

APA style

17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated). (2024, March 22). WikiPatents, . Retrieved 03:43, June 11, 2024 from http://wikipatents.org/index.php?title=17934023._CIRCUIT_PACKAGES_WITH_BUMP_INTERCONNECT_POLYMER_SURROUND_AND_METHOD_OF_MANUFACTURE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=41593.

MLA style

"17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)." WikiPatents, . 22 Mar 2024, 07:48 UTC. 11 Jun 2024, 03:43 <http://wikipatents.org/index.php?title=17934023._CIRCUIT_PACKAGES_WITH_BUMP_INTERCONNECT_POLYMER_SURROUND_AND_METHOD_OF_MANUFACTURE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=41593>.

MHRA style

WikiPatents contributors, '17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)', WikiPatents, , 22 March 2024, 07:48 UTC, <http://wikipatents.org/index.php?title=17934023._CIRCUIT_PACKAGES_WITH_BUMP_INTERCONNECT_POLYMER_SURROUND_AND_METHOD_OF_MANUFACTURE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=41593> [accessed 11 June 2024]

Chicago style

WikiPatents contributors, "17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)," WikiPatents, , http://wikipatents.org/index.php?title=17934023._CIRCUIT_PACKAGES_WITH_BUMP_INTERCONNECT_POLYMER_SURROUND_AND_METHOD_OF_MANUFACTURE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=41593 (accessed June 11, 2024).

CBE/CSE style

WikiPatents contributors. 17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated) [Internet]. WikiPatents, ; 2024 Mar 22, 07:48 UTC [cited 2024 Jun 11]. Available from: http://wikipatents.org/index.php?title=17934023._CIRCUIT_PACKAGES_WITH_BUMP_INTERCONNECT_POLYMER_SURROUND_AND_METHOD_OF_MANUFACTURE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=41593.

Bluebook style

17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated), http://wikipatents.org/index.php?title=17934023._CIRCUIT_PACKAGES_WITH_BUMP_INTERCONNECT_POLYMER_SURROUND_AND_METHOD_OF_MANUFACTURE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=41593 (last visited June 11, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17934023._CIRCUIT_PACKAGES_WITH_BUMP_INTERCONNECT_POLYMER_SURROUND_AND_METHOD_OF_MANUFACTURE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=41593",
   note = "[Online; accessed 11-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17934023._CIRCUIT_PACKAGES_WITH_BUMP_INTERCONNECT_POLYMER_SURROUND_AND_METHOD_OF_MANUFACTURE_simplified_abstract_(QUALCOMM_Incorporated)&oldid=41593}",
   note = "[Online; accessed 11-June-2024]"
 }


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