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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract

Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract

APA style

Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract. (2024, March 21). WikiPatents, . Retrieved 15:50, June 9, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096825)._BOND_HEAD_WITH_ELASTIC_MATERIAL_AROUND_PERIMETER_TO_IMPROVE_BONDING_QUALITY_simplified_abstract&oldid=40343.

MLA style

"Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract." WikiPatents, . 21 Mar 2024, 10:10 UTC. 9 Jun 2024, 15:50 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096825)._BOND_HEAD_WITH_ELASTIC_MATERIAL_AROUND_PERIMETER_TO_IMPROVE_BONDING_QUALITY_simplified_abstract&oldid=40343>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract', WikiPatents, , 21 March 2024, 10:10 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096825)._BOND_HEAD_WITH_ELASTIC_MATERIAL_AROUND_PERIMETER_TO_IMPROVE_BONDING_QUALITY_simplified_abstract&oldid=40343> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096825)._BOND_HEAD_WITH_ELASTIC_MATERIAL_AROUND_PERIMETER_TO_IMPROVE_BONDING_QUALITY_simplified_abstract&oldid=40343 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract [Internet]. WikiPatents, ; 2024 Mar 21, 10:10 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096825)._BOND_HEAD_WITH_ELASTIC_MATERIAL_AROUND_PERIMETER_TO_IMPROVE_BONDING_QUALITY_simplified_abstract&oldid=40343.

Bluebook style

Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096825)._BOND_HEAD_WITH_ELASTIC_MATERIAL_AROUND_PERIMETER_TO_IMPROVE_BONDING_QUALITY_simplified_abstract&oldid=40343 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096825)._BOND_HEAD_WITH_ELASTIC_MATERIAL_AROUND_PERIMETER_TO_IMPROVE_BONDING_QUALITY_simplified_abstract&oldid=40343",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096825)._BOND_HEAD_WITH_ELASTIC_MATERIAL_AROUND_PERIMETER_TO_IMPROVE_BONDING_QUALITY_simplified_abstract&oldid=40343}",
   note = "[Online; accessed 9-June-2024]"
 }


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