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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract
- Page name: Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 21 March 2024 10:07 UTC
- Date retrieved: 8 June 2024 02:27 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318
- Page Version ID: 40318
Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract
APA style
Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract. (2024, March 21). WikiPatents, . Retrieved 02:27, June 8, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318.
MLA style
"Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract." WikiPatents, . 21 Mar 2024, 10:07 UTC. 8 Jun 2024, 02:27 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318>.
MHRA style
WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract', WikiPatents, , 21 March 2024, 10:07 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318> [accessed 8 June 2024]
Chicago style
WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318 (accessed June 8, 2024).
CBE/CSE style
WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract [Internet]. WikiPatents, ; 2024 Mar 21, 10:07 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318.
Bluebook style
Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318 (last visited June 8, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318",
note = "[Online; accessed 8-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Taiwan semiconductor manufacturing co., ltd. (20240096707). Footing Removal in Cut-Metal Process simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096707)._Footing_Removal_in_Cut-Metal_Process_simplified_abstract&oldid=40318}",
note = "[Online; accessed 8-June-2024]"
}
