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Citation styles for 18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, March 16). WikiPatents, . Retrieved 06:37, June 8, 2024 from http://wikipatents.org/index.php?title=18149793._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37417.

MLA style

"18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 16 Mar 2024, 23:58 UTC. 8 Jun 2024, 06:37 <http://wikipatents.org/index.php?title=18149793._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37417>.

MHRA style

WikiPatents contributors, '18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 16 March 2024, 23:58 UTC, <http://wikipatents.org/index.php?title=18149793._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37417> [accessed 8 June 2024]

Chicago style

WikiPatents contributors, "18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18149793._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37417 (accessed June 8, 2024).

CBE/CSE style

WikiPatents contributors. 18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Mar 16, 23:58 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=18149793._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37417.

Bluebook style

18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18149793._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37417 (last visited June 8, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18149793._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37417",
   note = "[Online; accessed 8-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18149793._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37417}",
   note = "[Online; accessed 8-June-2024]"
 }