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Bibliographic details for 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- Page name: 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 16 March 2024 23:58 UTC
- Date retrieved: 3 June 2024 15:42 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407
- Page Version ID: 37407
Citation styles for 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
APA style
18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, March 16). WikiPatents, . Retrieved 15:42, June 3, 2024 from http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407.
MLA style
"18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 16 Mar 2024, 23:58 UTC. 3 Jun 2024, 15:42 <http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407>.
MHRA style
WikiPatents contributors, '18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 16 March 2024, 23:58 UTC, <http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407> [accessed 3 June 2024]
Chicago style
WikiPatents contributors, "18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407 (accessed June 3, 2024).
CBE/CSE style
WikiPatents contributors. 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Mar 16, 23:58 UTC [cited 2024 Jun 3]. Available from: http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407.
Bluebook style
18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407 (last visited June 3, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407", note = "[Online; accessed 3-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18514126._Chamfered_Die_of_Semiconductor_Package_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=37407}", note = "[Online; accessed 3-June-2024]" }