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Bibliographic details for 18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, March 16). WikiPatents, . Retrieved 16:47, June 3, 2024 from http://wikipatents.org/index.php?title=18518591._SEMICONDUCTOR_PACKAGE_UTILIZING_A_HYBRID_BONDING_PROCESS_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=37253.

MLA style

"18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 16 Mar 2024, 23:45 UTC. 3 Jun 2024, 16:47 <http://wikipatents.org/index.php?title=18518591._SEMICONDUCTOR_PACKAGE_UTILIZING_A_HYBRID_BONDING_PROCESS_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=37253>.

MHRA style

WikiPatents contributors, '18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 16 March 2024, 23:45 UTC, <http://wikipatents.org/index.php?title=18518591._SEMICONDUCTOR_PACKAGE_UTILIZING_A_HYBRID_BONDING_PROCESS_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=37253> [accessed 3 June 2024]

Chicago style

WikiPatents contributors, "18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18518591._SEMICONDUCTOR_PACKAGE_UTILIZING_A_HYBRID_BONDING_PROCESS_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=37253 (accessed June 3, 2024).

CBE/CSE style

WikiPatents contributors. 18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Mar 16, 23:45 UTC [cited 2024 Jun 3]. Available from: http://wikipatents.org/index.php?title=18518591._SEMICONDUCTOR_PACKAGE_UTILIZING_A_HYBRID_BONDING_PROCESS_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=37253.

Bluebook style

18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18518591._SEMICONDUCTOR_PACKAGE_UTILIZING_A_HYBRID_BONDING_PROCESS_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=37253 (last visited June 3, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18518591._SEMICONDUCTOR_PACKAGE_UTILIZING_A_HYBRID_BONDING_PROCESS_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=37253",
   note = "[Online; accessed 3-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18518591. SEMICONDUCTOR PACKAGE UTILIZING A HYBRID BONDING PROCESS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18518591._SEMICONDUCTOR_PACKAGE_UTILIZING_A_HYBRID_BONDING_PROCESS_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=37253}",
   note = "[Online; accessed 3-June-2024]"
 }


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