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Bibliographic details for THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)
- Page name: THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 October 2023 16:13 UTC
- Date retrieved: 5 June 2024 22:44 UTC
- Permanent URL: http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371
- Page Version ID: 371
Citation styles for THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)
APA style
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394). (2023, October 1). WikiPatents, . Retrieved 22:44, June 5, 2024 from http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371.
MLA style
"THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)." WikiPatents, . 1 Oct 2023, 16:13 UTC. 5 Jun 2024, 22:44 <http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371>.
MHRA style
WikiPatents contributors, 'THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)', WikiPatents, , 1 October 2023, 16:13 UTC, <http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371> [accessed 5 June 2024]
Chicago style
WikiPatents contributors, "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)," WikiPatents, , http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371 (accessed June 5, 2024).
CBE/CSE style
WikiPatents contributors. THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) [Internet]. WikiPatents, ; 2023 Oct 1, 16:13 UTC [cited 2024 Jun 5]. Available from: http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371.
Bluebook style
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394), http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371 (last visited June 5, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) --- WikiPatents{,} ", year = "2023", url = "http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371", note = "[Online; accessed 5-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) --- WikiPatents{,} ", year = "2023", url = "\url{http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371}", note = "[Online; accessed 5-June-2024]" }