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Bibliographic details for 17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

Citation styles for 17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, March 4). WikiPatents, . Retrieved 04:05, June 2, 2024 from http://wikipatents.org/index.php?title=17896083._INTERPOSER_SUBSTRATE,_PACKAGE_STRUCTURE_AND_MANUFACTURING_METHOD_OF_PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36828.

MLA style

"17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 4 Mar 2024, 05:46 UTC. 2 Jun 2024, 04:05 <http://wikipatents.org/index.php?title=17896083._INTERPOSER_SUBSTRATE,_PACKAGE_STRUCTURE_AND_MANUFACTURING_METHOD_OF_PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36828>.

MHRA style

WikiPatents contributors, '17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 4 March 2024, 05:46 UTC, <http://wikipatents.org/index.php?title=17896083._INTERPOSER_SUBSTRATE,_PACKAGE_STRUCTURE_AND_MANUFACTURING_METHOD_OF_PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36828> [accessed 2 June 2024]

Chicago style

WikiPatents contributors, "17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17896083._INTERPOSER_SUBSTRATE,_PACKAGE_STRUCTURE_AND_MANUFACTURING_METHOD_OF_PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36828 (accessed June 2, 2024).

CBE/CSE style

WikiPatents contributors. 17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Mar 4, 05:46 UTC [cited 2024 Jun 2]. Available from: http://wikipatents.org/index.php?title=17896083._INTERPOSER_SUBSTRATE,_PACKAGE_STRUCTURE_AND_MANUFACTURING_METHOD_OF_PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36828.

Bluebook style

17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=17896083._INTERPOSER_SUBSTRATE,_PACKAGE_STRUCTURE_AND_MANUFACTURING_METHOD_OF_PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36828 (last visited June 2, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17896083._INTERPOSER_SUBSTRATE,_PACKAGE_STRUCTURE_AND_MANUFACTURING_METHOD_OF_PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36828",
   note = "[Online; accessed 2-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17896083._INTERPOSER_SUBSTRATE,_PACKAGE_STRUCTURE_AND_MANUFACTURING_METHOD_OF_PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36828}",
   note = "[Online; accessed 2-June-2024]"
 }


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