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Bibliographic details for 17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
- Page name: 17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 March 2024 05:07 UTC
- Date retrieved: 9 June 2024 06:07 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433
- Page Version ID: 36433
Citation styles for 17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
APA style
17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.). (2024, March 4). WikiPatents, . Retrieved 06:07, June 9, 2024 from http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433.
MLA style
"17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)." WikiPatents, . 4 Mar 2024, 05:07 UTC. 9 Jun 2024, 06:07 <http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433>.
MHRA style
WikiPatents contributors, '17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)', WikiPatents, , 4 March 2024, 05:07 UTC, <http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433> [accessed 9 June 2024]
Chicago style
WikiPatents contributors, "17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433 (accessed June 9, 2024).
CBE/CSE style
WikiPatents contributors. 17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Mar 4, 05:07 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433.
Bluebook style
17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433 (last visited June 9, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433",
note = "[Online; accessed 9-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17896030._EXTENDED_BOND_PAD_FOR_SEMICONDUCTOR_DEVICE_ASSEMBLIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36433}",
note = "[Online; accessed 9-June-2024]"
}
