Cite This Page

Jump to navigation Jump to search

Bibliographic details for 17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)

Citation styles for 17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)

APA style

17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.). (2024, March 4). WikiPatents, . Retrieved 03:06, May 29, 2024 from http://wikipatents.org/index.php?title=17899550._WIRE_BONDING_DIRECTLY_ON_EXPOSED_CONDUCTIVE_VIAS_AND_INTERCONNECTS_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36429.

MLA style

"17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)." WikiPatents, . 4 Mar 2024, 05:06 UTC. 29 May 2024, 03:06 <http://wikipatents.org/index.php?title=17899550._WIRE_BONDING_DIRECTLY_ON_EXPOSED_CONDUCTIVE_VIAS_AND_INTERCONNECTS_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36429>.

MHRA style

WikiPatents contributors, '17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)', WikiPatents, , 4 March 2024, 05:06 UTC, <http://wikipatents.org/index.php?title=17899550._WIRE_BONDING_DIRECTLY_ON_EXPOSED_CONDUCTIVE_VIAS_AND_INTERCONNECTS_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36429> [accessed 29 May 2024]

Chicago style

WikiPatents contributors, "17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=17899550._WIRE_BONDING_DIRECTLY_ON_EXPOSED_CONDUCTIVE_VIAS_AND_INTERCONNECTS_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36429 (accessed May 29, 2024).

CBE/CSE style

WikiPatents contributors. 17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Mar 4, 05:06 UTC [cited 2024 May 29]. Available from: http://wikipatents.org/index.php?title=17899550._WIRE_BONDING_DIRECTLY_ON_EXPOSED_CONDUCTIVE_VIAS_AND_INTERCONNECTS_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36429.

Bluebook style

17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=17899550._WIRE_BONDING_DIRECTLY_ON_EXPOSED_CONDUCTIVE_VIAS_AND_INTERCONNECTS_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36429 (last visited May 29, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17899550._WIRE_BONDING_DIRECTLY_ON_EXPOSED_CONDUCTIVE_VIAS_AND_INTERCONNECTS_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36429",
   note = "[Online; accessed 29-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17899550._WIRE_BONDING_DIRECTLY_ON_EXPOSED_CONDUCTIVE_VIAS_AND_INTERCONNECTS_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36429}",
   note = "[Online; accessed 29-May-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"