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Bibliographic details for 17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)
- Page name: 17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 March 2024 05:04 UTC
- Date retrieved: 29 May 2024 00:26 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408
- Page Version ID: 36408
Citation styles for 17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)
APA style
17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.). (2024, March 4). WikiPatents, . Retrieved 00:26, May 29, 2024 from http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408.
MLA style
"17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)." WikiPatents, . 4 Mar 2024, 05:04 UTC. 29 May 2024, 00:26 <http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408>.
MHRA style
WikiPatents contributors, '17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)', WikiPatents, , 4 March 2024, 05:04 UTC, <http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408> [accessed 29 May 2024]
Chicago style
WikiPatents contributors, "17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408 (accessed May 29, 2024).
CBE/CSE style
WikiPatents contributors. 17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Mar 4, 05:04 UTC [cited 2024 May 29]. Available from: http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408.
Bluebook style
17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408 (last visited May 29, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408",
note = "[Online; accessed 29-May-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17823349._MULTI-CHIP_PACKAGE_WITH_ENHANCED_CONDUCTIVE_LAYER_ADHESION_simplified_abstract_(Micron_Technology,_Inc.)&oldid=36408}",
note = "[Online; accessed 29-May-2024]"
}
