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Bibliographic details for 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
- Page name: 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 March 2024 03:44 UTC
- Date retrieved: 2 June 2024 05:56 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178
- Page Version ID: 36178
Citation styles for 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
APA style
18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.). (2024, March 4). WikiPatents, . Retrieved 05:56, June 2, 2024 from http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178.
MLA style
"18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 4 Mar 2024, 03:44 UTC. 2 Jun 2024, 05:56 <http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178>.
MHRA style
WikiPatents contributors, '18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 4 March 2024, 03:44 UTC, <http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178> [accessed 2 June 2024]
Chicago style
WikiPatents contributors, "18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178 (accessed June 2, 2024).
CBE/CSE style
WikiPatents contributors. 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Mar 4, 03:44 UTC [cited 2024 Jun 2]. Available from: http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178.
Bluebook style
18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178 (last visited June 2, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178",
note = "[Online; accessed 2-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18323880._ELECTRONIC_DEVICE_INCLUDING_HEAT_PIPE_SURROUNDING_MULTIPLE_INTEGRATED_CIRCUITS_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=36178}",
note = "[Online; accessed 2-June-2024]"
}
