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Bibliographic details for 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- Page name: 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 20 February 2024 06:53 UTC
- Date retrieved: 29 May 2024 02:21 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313
- Page Version ID: 35313
Citation styles for 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
APA style
17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.). (2024, February 20). WikiPatents, . Retrieved 02:21, May 29, 2024 from http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313.
MLA style
"17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)." WikiPatents, . 20 Feb 2024, 06:53 UTC. 29 May 2024, 02:21 <http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313>.
MHRA style
WikiPatents contributors, '17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)', WikiPatents, , 20 February 2024, 06:53 UTC, <http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313> [accessed 29 May 2024]
Chicago style
WikiPatents contributors, "17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313 (accessed May 29, 2024).
CBE/CSE style
WikiPatents contributors. 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Feb 20, 06:53 UTC [cited 2024 May 29]. Available from: http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313.
Bluebook style
17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313 (last visited May 29, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313",
note = "[Online; accessed 29-May-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17884484._THROUGH-SUBSTRATE_CONNECTIONS_FOR_RECESSED_SEMICONDUCTOR_DIES_simplified_abstract_(Micron_Technology,_Inc.)&oldid=35313}",
note = "[Online; accessed 29-May-2024]"
}
