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Bibliographic details for 17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

Citation styles for 17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, February 20). WikiPatents, . Retrieved 21:26, June 9, 2024 from http://wikipatents.org/index.php?title=17819639._INTEGRATED_SEMICONDUCTOR_PACKAGING_SYSTEM_WITH_ENHANCED_DIELECTRIC-TO-DIELECTRIC_BONDING_QUALITY_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=35119.

MLA style

"17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 20 Feb 2024, 06:04 UTC. 9 Jun 2024, 21:26 <http://wikipatents.org/index.php?title=17819639._INTEGRATED_SEMICONDUCTOR_PACKAGING_SYSTEM_WITH_ENHANCED_DIELECTRIC-TO-DIELECTRIC_BONDING_QUALITY_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=35119>.

MHRA style

WikiPatents contributors, '17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 20 February 2024, 06:04 UTC, <http://wikipatents.org/index.php?title=17819639._INTEGRATED_SEMICONDUCTOR_PACKAGING_SYSTEM_WITH_ENHANCED_DIELECTRIC-TO-DIELECTRIC_BONDING_QUALITY_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=35119> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17819639._INTEGRATED_SEMICONDUCTOR_PACKAGING_SYSTEM_WITH_ENHANCED_DIELECTRIC-TO-DIELECTRIC_BONDING_QUALITY_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=35119 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Feb 20, 06:04 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17819639._INTEGRATED_SEMICONDUCTOR_PACKAGING_SYSTEM_WITH_ENHANCED_DIELECTRIC-TO-DIELECTRIC_BONDING_QUALITY_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=35119.

Bluebook style

17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=17819639._INTEGRATED_SEMICONDUCTOR_PACKAGING_SYSTEM_WITH_ENHANCED_DIELECTRIC-TO-DIELECTRIC_BONDING_QUALITY_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=35119 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17819639._INTEGRATED_SEMICONDUCTOR_PACKAGING_SYSTEM_WITH_ENHANCED_DIELECTRIC-TO-DIELECTRIC_BONDING_QUALITY_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=35119",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17819639._INTEGRATED_SEMICONDUCTOR_PACKAGING_SYSTEM_WITH_ENHANCED_DIELECTRIC-TO-DIELECTRIC_BONDING_QUALITY_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=35119}",
   note = "[Online; accessed 9-June-2024]"
 }


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