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Bibliographic details for 18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, February 9). WikiPatents, . Retrieved 08:27, June 2, 2024 from http://wikipatents.org/index.php?title=18490172._SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=33179.

MLA style

"18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 9 Feb 2024, 04:20 UTC. 2 Jun 2024, 08:27 <http://wikipatents.org/index.php?title=18490172._SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=33179>.

MHRA style

WikiPatents contributors, '18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 9 February 2024, 04:20 UTC, <http://wikipatents.org/index.php?title=18490172._SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=33179> [accessed 2 June 2024]

Chicago style

WikiPatents contributors, "18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18490172._SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=33179 (accessed June 2, 2024).

CBE/CSE style

WikiPatents contributors. 18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Feb 9, 04:20 UTC [cited 2024 Jun 2]. Available from: http://wikipatents.org/index.php?title=18490172._SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=33179.

Bluebook style

18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18490172._SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=33179 (last visited June 2, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18490172._SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=33179",
   note = "[Online; accessed 2-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18490172._SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=33179}",
   note = "[Online; accessed 2-June-2024]"
 }


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