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Bibliographic details for 17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, February 2). WikiPatents, . Retrieved 22:39, June 8, 2024 from http://wikipatents.org/index.php?title=17816055._NOVEL_METHOD_OF_FORMING_WAFER-TO-WAFER_BONDING_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31685.

MLA style

"17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 2 Feb 2024, 05:34 UTC. 8 Jun 2024, 22:39 <http://wikipatents.org/index.php?title=17816055._NOVEL_METHOD_OF_FORMING_WAFER-TO-WAFER_BONDING_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31685>.

MHRA style

WikiPatents contributors, '17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 2 February 2024, 05:34 UTC, <http://wikipatents.org/index.php?title=17816055._NOVEL_METHOD_OF_FORMING_WAFER-TO-WAFER_BONDING_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31685> [accessed 8 June 2024]

Chicago style

WikiPatents contributors, "17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17816055._NOVEL_METHOD_OF_FORMING_WAFER-TO-WAFER_BONDING_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31685 (accessed June 8, 2024).

CBE/CSE style

WikiPatents contributors. 17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Feb 2, 05:34 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=17816055._NOVEL_METHOD_OF_FORMING_WAFER-TO-WAFER_BONDING_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31685.

Bluebook style

17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=17816055._NOVEL_METHOD_OF_FORMING_WAFER-TO-WAFER_BONDING_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31685 (last visited June 8, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17816055._NOVEL_METHOD_OF_FORMING_WAFER-TO-WAFER_BONDING_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31685",
   note = "[Online; accessed 8-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17816055._NOVEL_METHOD_OF_FORMING_WAFER-TO-WAFER_BONDING_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31685}",
   note = "[Online; accessed 8-June-2024]"
 }


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