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Bibliographic details for 18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, February 2). WikiPatents, . Retrieved 05:28, June 8, 2024 from http://wikipatents.org/index.php?title=18150853._Packages_with_Liquid_Metal_as_Heat-Dissipation_Media_and_Method_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31672.

MLA style

"18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 2 Feb 2024, 05:32 UTC. 8 Jun 2024, 05:28 <http://wikipatents.org/index.php?title=18150853._Packages_with_Liquid_Metal_as_Heat-Dissipation_Media_and_Method_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31672>.

MHRA style

WikiPatents contributors, '18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 2 February 2024, 05:32 UTC, <http://wikipatents.org/index.php?title=18150853._Packages_with_Liquid_Metal_as_Heat-Dissipation_Media_and_Method_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31672> [accessed 8 June 2024]

Chicago style

WikiPatents contributors, "18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18150853._Packages_with_Liquid_Metal_as_Heat-Dissipation_Media_and_Method_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31672 (accessed June 8, 2024).

CBE/CSE style

WikiPatents contributors. 18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Feb 2, 05:32 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=18150853._Packages_with_Liquid_Metal_as_Heat-Dissipation_Media_and_Method_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31672.

Bluebook style

18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18150853._Packages_with_Liquid_Metal_as_Heat-Dissipation_Media_and_Method_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31672 (last visited June 8, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18150853._Packages_with_Liquid_Metal_as_Heat-Dissipation_Media_and_Method_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31672",
   note = "[Online; accessed 8-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18150853._Packages_with_Liquid_Metal_as_Heat-Dissipation_Media_and_Method_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31672}",
   note = "[Online; accessed 8-June-2024]"
 }


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