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Bibliographic details for 17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, February 2). WikiPatents, . Retrieved 05:51, June 8, 2024 from http://wikipatents.org/index.php?title=17815629._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31670.

MLA style

"17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 2 Feb 2024, 05:32 UTC. 8 Jun 2024, 05:51 <http://wikipatents.org/index.php?title=17815629._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31670>.

MHRA style

WikiPatents contributors, '17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 2 February 2024, 05:32 UTC, <http://wikipatents.org/index.php?title=17815629._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31670> [accessed 8 June 2024]

Chicago style

WikiPatents contributors, "17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17815629._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31670 (accessed June 8, 2024).

CBE/CSE style

WikiPatents contributors. 17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Feb 2, 05:32 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=17815629._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31670.

Bluebook style

17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=17815629._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31670 (last visited June 8, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17815629._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31670",
   note = "[Online; accessed 8-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17815629._Integrated_Circuit_Packages_and_Methods_of_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31670}",
   note = "[Online; accessed 8-June-2024]"
 }


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