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Bibliographic details for 18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, February 2). WikiPatents, . Retrieved 09:14, June 9, 2024 from http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664.

MLA style

"18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 2 Feb 2024, 05:31 UTC. 9 Jun 2024, 09:15 <http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664>.

MHRA style

WikiPatents contributors, '18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 2 February 2024, 05:31 UTC, <http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Feb 2, 05:31 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664.

Bluebook style

18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18192770._Forming_Openings_Through_Carrier_Substrate_of_IC_Package_Assembly_for_Fault_Identification_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=31664}",
   note = "[Online; accessed 9-June-2024]"
 }


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