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Bibliographic details for 20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, February 2). WikiPatents, . Retrieved 22:55, June 6, 2024 from http://wikipatents.org/index.php?title=20240040701._Forming_Trench_In_IC_Chip_Through_Multiple_Trench_Formation_And_Deposition_Processes_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=30973.

MLA style

"20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 2 Feb 2024, 04:11 UTC. 6 Jun 2024, 22:55 <http://wikipatents.org/index.php?title=20240040701._Forming_Trench_In_IC_Chip_Through_Multiple_Trench_Formation_And_Deposition_Processes_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=30973>.

MHRA style

WikiPatents contributors, '20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 2 February 2024, 04:11 UTC, <http://wikipatents.org/index.php?title=20240040701._Forming_Trench_In_IC_Chip_Through_Multiple_Trench_Formation_And_Deposition_Processes_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=30973> [accessed 6 June 2024]

Chicago style

WikiPatents contributors, "20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=20240040701._Forming_Trench_In_IC_Chip_Through_Multiple_Trench_Formation_And_Deposition_Processes_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=30973 (accessed June 6, 2024).

CBE/CSE style

WikiPatents contributors. 20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Feb 2, 04:11 UTC [cited 2024 Jun 6]. Available from: http://wikipatents.org/index.php?title=20240040701._Forming_Trench_In_IC_Chip_Through_Multiple_Trench_Formation_And_Deposition_Processes_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=30973.

Bluebook style

20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=20240040701._Forming_Trench_In_IC_Chip_Through_Multiple_Trench_Formation_And_Deposition_Processes_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=30973 (last visited June 6, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=20240040701._Forming_Trench_In_IC_Chip_Through_Multiple_Trench_Formation_And_Deposition_Processes_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=30973",
   note = "[Online; accessed 6-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=20240040701._Forming_Trench_In_IC_Chip_Through_Multiple_Trench_Formation_And_Deposition_Processes_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=30973}",
   note = "[Online; accessed 6-June-2024]"
 }


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