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Bibliographic details for 17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

Citation styles for 17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

APA style

17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION). (2024, January 4). WikiPatents, . Retrieved 14:34, June 8, 2024 from http://wikipatents.org/index.php?title=17550157._INTEGRATED_CIRCUIT_CHIP_HAVING_BACK-SURFACE_TOPOGRAPHY_FOR_ENHANCED_COOLING_DURING_CHIP_TESTING_simplified_abstract_(INTERNATIONAL_BUSINESS_MACHINES_CORPORATION)&oldid=26215.

MLA style

"17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)." WikiPatents, . 4 Jan 2024, 09:34 UTC. 8 Jun 2024, 14:34 <http://wikipatents.org/index.php?title=17550157._INTEGRATED_CIRCUIT_CHIP_HAVING_BACK-SURFACE_TOPOGRAPHY_FOR_ENHANCED_COOLING_DURING_CHIP_TESTING_simplified_abstract_(INTERNATIONAL_BUSINESS_MACHINES_CORPORATION)&oldid=26215>.

MHRA style

WikiPatents contributors, '17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)', WikiPatents, , 4 January 2024, 09:34 UTC, <http://wikipatents.org/index.php?title=17550157._INTEGRATED_CIRCUIT_CHIP_HAVING_BACK-SURFACE_TOPOGRAPHY_FOR_ENHANCED_COOLING_DURING_CHIP_TESTING_simplified_abstract_(INTERNATIONAL_BUSINESS_MACHINES_CORPORATION)&oldid=26215> [accessed 8 June 2024]

Chicago style

WikiPatents contributors, "17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)," WikiPatents, , http://wikipatents.org/index.php?title=17550157._INTEGRATED_CIRCUIT_CHIP_HAVING_BACK-SURFACE_TOPOGRAPHY_FOR_ENHANCED_COOLING_DURING_CHIP_TESTING_simplified_abstract_(INTERNATIONAL_BUSINESS_MACHINES_CORPORATION)&oldid=26215 (accessed June 8, 2024).

CBE/CSE style

WikiPatents contributors. 17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION) [Internet]. WikiPatents, ; 2024 Jan 4, 09:34 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=17550157._INTEGRATED_CIRCUIT_CHIP_HAVING_BACK-SURFACE_TOPOGRAPHY_FOR_ENHANCED_COOLING_DURING_CHIP_TESTING_simplified_abstract_(INTERNATIONAL_BUSINESS_MACHINES_CORPORATION)&oldid=26215.

Bluebook style

17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION), http://wikipatents.org/index.php?title=17550157._INTEGRATED_CIRCUIT_CHIP_HAVING_BACK-SURFACE_TOPOGRAPHY_FOR_ENHANCED_COOLING_DURING_CHIP_TESTING_simplified_abstract_(INTERNATIONAL_BUSINESS_MACHINES_CORPORATION)&oldid=26215 (last visited June 8, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17550157._INTEGRATED_CIRCUIT_CHIP_HAVING_BACK-SURFACE_TOPOGRAPHY_FOR_ENHANCED_COOLING_DURING_CHIP_TESTING_simplified_abstract_(INTERNATIONAL_BUSINESS_MACHINES_CORPORATION)&oldid=26215",
   note = "[Online; accessed 8-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17550157._INTEGRATED_CIRCUIT_CHIP_HAVING_BACK-SURFACE_TOPOGRAPHY_FOR_ENHANCED_COOLING_DURING_CHIP_TESTING_simplified_abstract_(INTERNATIONAL_BUSINESS_MACHINES_CORPORATION)&oldid=26215}",
   note = "[Online; accessed 8-June-2024]"
 }


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