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Bibliographic details for 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)

Citation styles for 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)

APA style

18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.). (2024, January 4). WikiPatents, . Retrieved 21:56, June 10, 2024 from http://wikipatents.org/index.php?title=18156287._HIGH_BANDWIDTH_DIE_TO_DIE_INTERCONNECT_WITH_PACKAGE_AREA_REDUCTION_simplified_abstract_(Apple_Inc.)&oldid=23990.

MLA style

"18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)." WikiPatents, . 4 Jan 2024, 02:51 UTC. 10 Jun 2024, 21:56 <http://wikipatents.org/index.php?title=18156287._HIGH_BANDWIDTH_DIE_TO_DIE_INTERCONNECT_WITH_PACKAGE_AREA_REDUCTION_simplified_abstract_(Apple_Inc.)&oldid=23990>.

MHRA style

WikiPatents contributors, '18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)', WikiPatents, , 4 January 2024, 02:51 UTC, <http://wikipatents.org/index.php?title=18156287._HIGH_BANDWIDTH_DIE_TO_DIE_INTERCONNECT_WITH_PACKAGE_AREA_REDUCTION_simplified_abstract_(Apple_Inc.)&oldid=23990> [accessed 10 June 2024]

Chicago style

WikiPatents contributors, "18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=18156287._HIGH_BANDWIDTH_DIE_TO_DIE_INTERCONNECT_WITH_PACKAGE_AREA_REDUCTION_simplified_abstract_(Apple_Inc.)&oldid=23990 (accessed June 10, 2024).

CBE/CSE style

WikiPatents contributors. 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.) [Internet]. WikiPatents, ; 2024 Jan 4, 02:51 UTC [cited 2024 Jun 10]. Available from: http://wikipatents.org/index.php?title=18156287._HIGH_BANDWIDTH_DIE_TO_DIE_INTERCONNECT_WITH_PACKAGE_AREA_REDUCTION_simplified_abstract_(Apple_Inc.)&oldid=23990.

Bluebook style

18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.), http://wikipatents.org/index.php?title=18156287._HIGH_BANDWIDTH_DIE_TO_DIE_INTERCONNECT_WITH_PACKAGE_AREA_REDUCTION_simplified_abstract_(Apple_Inc.)&oldid=23990 (last visited June 10, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18156287._HIGH_BANDWIDTH_DIE_TO_DIE_INTERCONNECT_WITH_PACKAGE_AREA_REDUCTION_simplified_abstract_(Apple_Inc.)&oldid=23990",
   note = "[Online; accessed 10-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18156287._HIGH_BANDWIDTH_DIE_TO_DIE_INTERCONNECT_WITH_PACKAGE_AREA_REDUCTION_simplified_abstract_(Apple_Inc.)&oldid=23990}",
   note = "[Online; accessed 10-June-2024]"
 }


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