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Bibliographic details for 18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, January 4). WikiPatents, . Retrieved 03:17, June 8, 2024 from http://wikipatents.org/index.php?title=18149509._3D_Package_Structure_and_Methods_of_Forming_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23639.

MLA style

"18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 4 Jan 2024, 02:04 UTC. 8 Jun 2024, 03:17 <http://wikipatents.org/index.php?title=18149509._3D_Package_Structure_and_Methods_of_Forming_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23639>.

MHRA style

WikiPatents contributors, '18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 4 January 2024, 02:04 UTC, <http://wikipatents.org/index.php?title=18149509._3D_Package_Structure_and_Methods_of_Forming_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23639> [accessed 8 June 2024]

Chicago style

WikiPatents contributors, "18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18149509._3D_Package_Structure_and_Methods_of_Forming_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23639 (accessed June 8, 2024).

CBE/CSE style

WikiPatents contributors. 18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 4, 02:04 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=18149509._3D_Package_Structure_and_Methods_of_Forming_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23639.

Bluebook style

18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18149509._3D_Package_Structure_and_Methods_of_Forming_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23639 (last visited June 8, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18149509._3D_Package_Structure_and_Methods_of_Forming_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23639",
   note = "[Online; accessed 8-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18149509._3D_Package_Structure_and_Methods_of_Forming_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23639}",
   note = "[Online; accessed 8-June-2024]"
 }


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