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Bibliographic details for 18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Page name: 18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 January 2024 02:02 UTC
- Date retrieved: 28 May 2024 22:57 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627
- Page Version ID: 23627
Citation styles for 18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
APA style
18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, January 4). WikiPatents, . Retrieved 22:57, May 28, 2024 from http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627.
MLA style
"18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 4 Jan 2024, 02:02 UTC. 28 May 2024, 22:57 <http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627>.
MHRA style
WikiPatents contributors, '18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 4 January 2024, 02:02 UTC, <http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627> [accessed 28 May 2024]
Chicago style
WikiPatents contributors, "18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627 (accessed May 28, 2024).
CBE/CSE style
WikiPatents contributors. 18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 4, 02:02 UTC [cited 2024 May 28]. Available from: http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627.
Bluebook style
18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627 (last visited May 28, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627",
note = "[Online; accessed 28-May-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18157509._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23627}",
note = "[Online; accessed 28-May-2024]"
}
