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Bibliographic details for 17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Page name: 17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 January 2024 02:02 UTC
- Date retrieved: 9 June 2024 06:46 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626
- Page Version ID: 23626
Citation styles for 17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
APA style
17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, January 4). WikiPatents, . Retrieved 06:46, June 9, 2024 from http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626.
MLA style
"17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 4 Jan 2024, 02:02 UTC. 9 Jun 2024, 06:46 <http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626>.
MHRA style
WikiPatents contributors, '17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 4 January 2024, 02:02 UTC, <http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626> [accessed 9 June 2024]
Chicago style
WikiPatents contributors, "17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626 (accessed June 9, 2024).
CBE/CSE style
WikiPatents contributors. 17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 4, 02:02 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626.
Bluebook style
17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626 (last visited June 9, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626",
note = "[Online; accessed 9-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17651665._Wafer_Bonding_Incorporating_Thermal_Conductive_Paths_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=23626}",
note = "[Online; accessed 9-June-2024]"
}
