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Bibliographic details for 17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, January 4). WikiPatents, . Retrieved 08:56, May 23, 2024 from http://wikipatents.org/index.php?title=17899025._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23038.

MLA style

"17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 4 Jan 2024, 00:47 UTC. 23 May 2024, 08:56 <http://wikipatents.org/index.php?title=17899025._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23038>.

MHRA style

WikiPatents contributors, '17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 4 January 2024, 00:47 UTC, <http://wikipatents.org/index.php?title=17899025._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23038> [accessed 23 May 2024]

Chicago style

WikiPatents contributors, "17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17899025._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23038 (accessed May 23, 2024).

CBE/CSE style

WikiPatents contributors. 17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jan 4, 00:47 UTC [cited 2024 May 23]. Available from: http://wikipatents.org/index.php?title=17899025._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23038.

Bluebook style

17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=17899025._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23038 (last visited May 23, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17899025._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23038",
   note = "[Online; accessed 23-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17899025._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23038}",
   note = "[Online; accessed 23-May-2024]"
 }


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