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Bibliographic details for 18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, January 4). WikiPatents, . Retrieved 23:13, June 4, 2024 from http://wikipatents.org/index.php?title=18093880._SEMICONDUCTOR_DEVICES_INCLUDING_A_THICK_METAL_LAYER_AND_A_BUMP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23034.

MLA style

"18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 4 Jan 2024, 00:46 UTC. 4 Jun 2024, 23:13 <http://wikipatents.org/index.php?title=18093880._SEMICONDUCTOR_DEVICES_INCLUDING_A_THICK_METAL_LAYER_AND_A_BUMP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23034>.

MHRA style

WikiPatents contributors, '18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 4 January 2024, 00:46 UTC, <http://wikipatents.org/index.php?title=18093880._SEMICONDUCTOR_DEVICES_INCLUDING_A_THICK_METAL_LAYER_AND_A_BUMP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23034> [accessed 4 June 2024]

Chicago style

WikiPatents contributors, "18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18093880._SEMICONDUCTOR_DEVICES_INCLUDING_A_THICK_METAL_LAYER_AND_A_BUMP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23034 (accessed June 4, 2024).

CBE/CSE style

WikiPatents contributors. 18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jan 4, 00:46 UTC [cited 2024 Jun 4]. Available from: http://wikipatents.org/index.php?title=18093880._SEMICONDUCTOR_DEVICES_INCLUDING_A_THICK_METAL_LAYER_AND_A_BUMP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23034.

Bluebook style

18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18093880._SEMICONDUCTOR_DEVICES_INCLUDING_A_THICK_METAL_LAYER_AND_A_BUMP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23034 (last visited June 4, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18093880._SEMICONDUCTOR_DEVICES_INCLUDING_A_THICK_METAL_LAYER_AND_A_BUMP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23034",
   note = "[Online; accessed 4-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18093880._SEMICONDUCTOR_DEVICES_INCLUDING_A_THICK_METAL_LAYER_AND_A_BUMP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23034}",
   note = "[Online; accessed 4-June-2024]"
 }


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