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Bibliographic details for 17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, January 4). WikiPatents, . Retrieved 07:56, May 23, 2024 from http://wikipatents.org/index.php?title=17935122._STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23014.

MLA style

"17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 4 Jan 2024, 00:44 UTC. 23 May 2024, 07:56 <http://wikipatents.org/index.php?title=17935122._STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23014>.

MHRA style

WikiPatents contributors, '17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 4 January 2024, 00:44 UTC, <http://wikipatents.org/index.php?title=17935122._STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23014> [accessed 23 May 2024]

Chicago style

WikiPatents contributors, "17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17935122._STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23014 (accessed May 23, 2024).

CBE/CSE style

WikiPatents contributors. 17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jan 4, 00:44 UTC [cited 2024 May 23]. Available from: http://wikipatents.org/index.php?title=17935122._STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23014.

Bluebook style

17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=17935122._STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23014 (last visited May 23, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17935122._STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23014",
   note = "[Online; accessed 23-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17935122. STORAGE DEVICE USING WAFER-TO-WAFER BONDING AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17935122._STORAGE_DEVICE_USING_WAFER-TO-WAFER_BONDING_AND_METHOD_OF_MANUFACTURING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=23014}",
   note = "[Online; accessed 23-May-2024]"
 }


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