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Bibliographic details for 17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, January 4). WikiPatents, . Retrieved 11:51, May 23, 2024 from http://wikipatents.org/index.php?title=17742667._COMPOUND_FOR_FORMING_HARDMASK,_HARDMASK_COMPOSITION_INCLUDING_THE_COMPOUND,_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_HARDMASK_COMPOSITION_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=22880.

MLA style

"17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 4 Jan 2024, 00:29 UTC. 23 May 2024, 11:51 <http://wikipatents.org/index.php?title=17742667._COMPOUND_FOR_FORMING_HARDMASK,_HARDMASK_COMPOSITION_INCLUDING_THE_COMPOUND,_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_HARDMASK_COMPOSITION_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=22880>.

MHRA style

WikiPatents contributors, '17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 4 January 2024, 00:29 UTC, <http://wikipatents.org/index.php?title=17742667._COMPOUND_FOR_FORMING_HARDMASK,_HARDMASK_COMPOSITION_INCLUDING_THE_COMPOUND,_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_HARDMASK_COMPOSITION_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=22880> [accessed 23 May 2024]

Chicago style

WikiPatents contributors, "17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17742667._COMPOUND_FOR_FORMING_HARDMASK,_HARDMASK_COMPOSITION_INCLUDING_THE_COMPOUND,_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_HARDMASK_COMPOSITION_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=22880 (accessed May 23, 2024).

CBE/CSE style

WikiPatents contributors. 17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jan 4, 00:29 UTC [cited 2024 May 23]. Available from: http://wikipatents.org/index.php?title=17742667._COMPOUND_FOR_FORMING_HARDMASK,_HARDMASK_COMPOSITION_INCLUDING_THE_COMPOUND,_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_HARDMASK_COMPOSITION_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=22880.

Bluebook style

17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=17742667._COMPOUND_FOR_FORMING_HARDMASK,_HARDMASK_COMPOSITION_INCLUDING_THE_COMPOUND,_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_HARDMASK_COMPOSITION_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=22880 (last visited May 23, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17742667._COMPOUND_FOR_FORMING_HARDMASK,_HARDMASK_COMPOSITION_INCLUDING_THE_COMPOUND,_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_HARDMASK_COMPOSITION_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=22880",
   note = "[Online; accessed 23-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17742667._COMPOUND_FOR_FORMING_HARDMASK,_HARDMASK_COMPOSITION_INCLUDING_THE_COMPOUND,_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_HARDMASK_COMPOSITION_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=22880}",
   note = "[Online; accessed 23-May-2024]"
 }


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