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Bibliographic details for 17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)

Citation styles for 17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)

APA style

17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated). (2024, January 2). WikiPatents, . Retrieved 14:08, June 9, 2024 from http://wikipatents.org/index.php?title=17478539._INTEGRATED_CIRCUITS_(ICs)_EMPLOYING_DIRECTLY_COUPLED_METAL_LINES_BETWEEN_VERTICALLY-ADJACENT_INTERCONNECT_LAYERS_FOR_REDUCED_COUPLING_RESISTANCE,_AND_RELATED_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=21499.

MLA style

"17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)." WikiPatents, . 2 Jan 2024, 18:15 UTC. 9 Jun 2024, 14:08 <http://wikipatents.org/index.php?title=17478539._INTEGRATED_CIRCUITS_(ICs)_EMPLOYING_DIRECTLY_COUPLED_METAL_LINES_BETWEEN_VERTICALLY-ADJACENT_INTERCONNECT_LAYERS_FOR_REDUCED_COUPLING_RESISTANCE,_AND_RELATED_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=21499>.

MHRA style

WikiPatents contributors, '17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)', WikiPatents, , 2 January 2024, 18:15 UTC, <http://wikipatents.org/index.php?title=17478539._INTEGRATED_CIRCUITS_(ICs)_EMPLOYING_DIRECTLY_COUPLED_METAL_LINES_BETWEEN_VERTICALLY-ADJACENT_INTERCONNECT_LAYERS_FOR_REDUCED_COUPLING_RESISTANCE,_AND_RELATED_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=21499> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)," WikiPatents, , http://wikipatents.org/index.php?title=17478539._INTEGRATED_CIRCUITS_(ICs)_EMPLOYING_DIRECTLY_COUPLED_METAL_LINES_BETWEEN_VERTICALLY-ADJACENT_INTERCONNECT_LAYERS_FOR_REDUCED_COUPLING_RESISTANCE,_AND_RELATED_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=21499 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated) [Internet]. WikiPatents, ; 2024 Jan 2, 18:15 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17478539._INTEGRATED_CIRCUITS_(ICs)_EMPLOYING_DIRECTLY_COUPLED_METAL_LINES_BETWEEN_VERTICALLY-ADJACENT_INTERCONNECT_LAYERS_FOR_REDUCED_COUPLING_RESISTANCE,_AND_RELATED_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=21499.

Bluebook style

17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated), http://wikipatents.org/index.php?title=17478539._INTEGRATED_CIRCUITS_(ICs)_EMPLOYING_DIRECTLY_COUPLED_METAL_LINES_BETWEEN_VERTICALLY-ADJACENT_INTERCONNECT_LAYERS_FOR_REDUCED_COUPLING_RESISTANCE,_AND_RELATED_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=21499 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17478539._INTEGRATED_CIRCUITS_(ICs)_EMPLOYING_DIRECTLY_COUPLED_METAL_LINES_BETWEEN_VERTICALLY-ADJACENT_INTERCONNECT_LAYERS_FOR_REDUCED_COUPLING_RESISTANCE,_AND_RELATED_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=21499",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17478539._INTEGRATED_CIRCUITS_(ICs)_EMPLOYING_DIRECTLY_COUPLED_METAL_LINES_BETWEEN_VERTICALLY-ADJACENT_INTERCONNECT_LAYERS_FOR_REDUCED_COUPLING_RESISTANCE,_AND_RELATED_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=21499}",
   note = "[Online; accessed 9-June-2024]"
 }


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