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Bibliographic details for 17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, January 2). WikiPatents, . Retrieved 02:20, June 12, 2024 from http://wikipatents.org/index.php?title=17743819._3D_LAMINATED_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_3D_LAMINATED_CHIP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=21039.

MLA style

"17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 2 Jan 2024, 17:14 UTC. 12 Jun 2024, 02:20 <http://wikipatents.org/index.php?title=17743819._3D_LAMINATED_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_3D_LAMINATED_CHIP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=21039>.

MHRA style

WikiPatents contributors, '17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 2 January 2024, 17:14 UTC, <http://wikipatents.org/index.php?title=17743819._3D_LAMINATED_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_3D_LAMINATED_CHIP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=21039> [accessed 12 June 2024]

Chicago style

WikiPatents contributors, "17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17743819._3D_LAMINATED_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_3D_LAMINATED_CHIP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=21039 (accessed June 12, 2024).

CBE/CSE style

WikiPatents contributors. 17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 17:14 UTC [cited 2024 Jun 12]. Available from: http://wikipatents.org/index.php?title=17743819._3D_LAMINATED_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_3D_LAMINATED_CHIP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=21039.

Bluebook style

17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=17743819._3D_LAMINATED_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_3D_LAMINATED_CHIP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=21039 (last visited June 12, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17743819._3D_LAMINATED_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_3D_LAMINATED_CHIP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=21039",
   note = "[Online; accessed 12-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17743819._3D_LAMINATED_CHIP,_AND_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_3D_LAMINATED_CHIP_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=21039}",
   note = "[Online; accessed 12-June-2024]"
 }


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